Symposium H
Electroactive Polymers and Shape Memory Polymers:
Advances in Materials and Devices

Programme Chair:
Jinsong LENG, Harbin Institute of Technology, China
Alvo AABLOO, University of Tartu, Estonia
Iain Alexander ANDERSON, Auckland Bioengineering Institute, New Zealand
Kinji ASAKA, AIST Kansai, Japan
Ray BAUGHMAN, University of Texas, Dallas, USA
Federico CARPI, Queen Mary University of London, UK
Zhongyang CHENG, Auburn University, USA
Hyouk Ryeol CHOI, Sungkyunkwan University, South Korea
Stephen DUCHARME, University of Nebraska, USA
Jian Ping GONG, Hokkaido University, Japan
Salvatore GRAZIANI, Università di Catania, Italy
Jinlian HU, Kong Kong Polytechnic University, Hong Kong
Yahya Ahmed ISMAIL, A'Sharqiyah University, Oman
Edwin JAGER, Linkoping University, Sweden
Keiichi KANETO, Osaka Institute of Technology, Japan
Seon Jeong KIM, Hanyang University, South Korea
Guggi KOFOD, Inmold A/S, Denmark
Roy KORNBLUH, SRI International, USA
Gih Keong LAU, Nanyang Technological University, Singapore
Doug MacFARLANE, Monash University, Australia
Hani E. NAGUIB, University of Toronto, Canada
Qing-Qing NI, Shinshu University, Japan
Hidenori OKUZAKI, University of Yamanashi, Japan
Yoshihito OSADA, RIKEN, Japan
Mika PAAJANEN, VTT, Tech.Research Centre of Finland, Finland
Qibing PEI, University of California, Los Angeles, USA
Herbert SHEA, EPFL, Switzerland
Anuvat SIRIVAT, Chulalongkorn University, Thailand
Witold SOKOLOWSKI, California Institute of Technology, USA
Ji SU, NASA Langley Research Center, USA
G.P. TANDON, University of Dayton Research Institute, USA
Frédéric VIDAL, Cergy-Pontoise, France
Qiming ZHANG, Penn State University, USA
Shaobing ZHOU, Southwest Jiaotong University, China
Mitchell ANTHAMATTEN, University of Rochester, USA
Kinji ASAKA, AIST, Japan
Yoseph BAR-COHEN, Jet Propulsion Lab (JPL), USA
Ray BAUGHMAN, University of Texas at Dallas, USA
Christopher N. BOWMAN, University of Colorado, USA
Seiki CHIBA, Chiba Science Institute, Japan
Masaki FUCHIWAKI, Kyushu Institute of Technology, Japan
Ingrid GRAZ, Johannes Kepler University Linz, Austria
Jinlian HU, Kong Kong Polytechnic University, Hong Kong
Hidenori OKUZAKI, University of Yamanashi, Japan
Cedric PLESSE, Université de Cergy-Pontoise, France
Herbert SHEA, EPFL, Switzerland
Stoyan K. SMOUKOV, University of Cambridge, UK
Shigeki TSUCHITANI, Wakayama University, Japan
Frédéric VIDAL, University of Cergy-Pontoise, France
Gordon G. WALLACE, University of Wollongong, Australia
Jianwen ZHAO, Harbin Institute of Technology, China
The special capability of inducing large deformation, fast response and long lifetime, light weights, lower density and higher resilience compared to other smart materials (piezoelectric ceramics and shape memory alloys), brings electroactive polymers (EAPs) and shape memory polymers (SMPs) into a broad application field. Their intrinsic properties of EAPs not only as actuators targeted to augment and possibly replace biological muscles, but also in a number of different areas as sensors, displays, energy harvesters, and microelectronic, optical, bio-mimetic and MEMS devices are exploited. SMPs can deliver active properties and autonomic responding. Large-scale actuated bending, extending, and folding structures would enable the deployment of antennae in space and the development of morphing wings on unmanned aerial vehicles. Other applications for new active materials include smart sensors, solar arrays, tactual displays, self-healing composite systems, smart textiles and fabrics, shape adaptive systems, biomedical devices, energy efficient locomotion and concealment. In order to improve the important progress, several challenges must be addressed if EAPs and SMPs are to be a successful and viable technology. A deeper theoretical and practical understanding on how these materials work, the ideation of new design approaches to efficient operation, and ensuring reliable and reproducible processing and characterization methods for materials and devices as well as stimuli methods are among the several issues to cope with.
This symposium, following the ones on the same topic held on the frames of previous CIMTEC Conferences, is aimed at presenting the current status of EAPs and SMPs research, showing the ongoing case applications and discussing the potential of smart materials’ technology in the future.
Session Topics

H-1 Advances in EAP materials

Synthesis, processing, shaping, fabrication
•    Field activated EAPs: dielectric, ferroelectric, electrostrictive and liquid crystalline polymers
•    Ionic EAPs: conductive polymers, IPMCs, responsive gels, carbon nanotubes
•    Bulks, fibers, thick/thin films, composites, hybrid systems
•    Electrode materials and conducting EAPs

H-2 Analysis and mechanical mechanisms

•    Constitutive Theory
•    Dynamics and thermodynamics, energy dissipation
•    Modelling, simulation and optimal design
•    Phase transitions
•    Mass/charge transport
•    Polarization
•    Stability, failure and allowable area

H-3 Device development and integration technologies

•    EAPs sensors and actuators design and engineering
•    EAPs-based M/NEMS, bio-M/NEMS, MOEMS
•    Transducers
•    System integration: driving electronics, packaging, software,  hardware, signal processing and control
•    Devices/system design, and modelling
•    Efficiency, performance, reliability and lifetime issues
•    Flexible and stretchable electronics devices

H-4 Applications of EAPs

•    Biomedical
•    Soft Robotics
•    Biomimetics
•    Biochemical
•    Energy system: Power Generation and Energy Harvesting
•    Optics
•    Aerospace
•    Microelectronics
•    Noise and vibration control
•    Smart structures
•    Machine
•    Haptic devices
•    Pumps and loudspeaker
•    Industry, consumer goods, etc

H-5 Advances in SMPs

•    Fabrication of SMPs
•    Multi-shape memory effect
•    Structures: fibers, bulks, and forms
•    Multifunctional properties
•    Simulation and constitutive models

H-6 Applications of SMPs and their composites

•    Deployable structures
•    Morphing structures
•    Biomedicine and bioinspiration
•    MEMS and NEMS applications
•    Self-healing composite system
•    Textiles
•    Foams


Cimtec 2016

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