H-3

•    EAPs sensors and actuators design and engineering
•    EAPs-based M/NEMS, bio-M/NEMS, MOEMS
•    Transducers
•    System integration: driving electronics, packaging, software,  hardware, signal processing and control
•    Devices/system design, and modelling
•    Efficiency, performance, reliability and lifetime issues
•    Flexible and stretchable electronics devices